1.Fine mesh qauv: Standard qhib qhov ntau thiab tsawg ntawm approx . 0.5 hli mus rau hauv qab 0.1 hli, thiab qhov tsawg kawg nkaus strand dav yuav ncav cuag 0.1 hli. Qhov qhib qhov sib piv tuaj yeem hloov kho tau yooj yim los ntawm kev hloov kho strand dav, lub hauv paus hlau thickness thiab nthuav piv.
2.Qhov chaw qhib siab: Tsis muaj cov khoom siv raw khoom pov tseg thaum lub sijhawm tsim khoom; qhov chaw qhib ntawm cov khoom tiav tuaj yeem tsoo 30% -60% lossis siab dua thaum tswj kev ruaj khov ntawm cov qauv.
3.Outstanding zog-rau- qhov hnyav piv: Cov pob zeb diamond sib txuas sib npaug sib npaug faib cov khoom thauj, xa lub zog ntau dua li feem ntau cov xov mesh thiab etched mesh ntawm qhov hnyav tib yam.
4.Customizable nto tiav: Flattened hom nta du, burr -dawb nto haum rau txheej, luam ntawv thiab daim ntawv thov yuav tsum tau nruj nreem tiv tauj; tsa hom muaj 3D cov qauv tsis sib xws, dav siv rau kev sib xyaw ua kua thiab catalyst carrier substrates.
5.Superior hluav taws xob thiab thermal conductivity: Weld-dawb thiab seamless integral strands muab uninterrupted, ruaj khov conductive txoj kev.
6.Excellent formability: Ultra-thin micro expanded foil mesh tuaj yeem khoov, dov thiab tuag- txiav rau hauv ntau yam tshwj xeeb- zoo li cov khoom.
